OUR NEW 2009 PHOTONICS CATALOG IS COMING SOON!
Pick it up at Photonics West 2009 or go online to pre-order your copy today.
Photonics West 2009
January 27-29, 2009
San Jose Convention Center
Visit us at booth #1212
METROLOGY MATTERS!
At PPC, we have developed advanced methods to measure the optical properties of our devices because measurement is fundamental to everything we do. The method shown here is Differential Interference Contrast Microscopy (DICM), also known as Nomarski imaging; it is the primary tool used for characterizing sub- Angstrom surfaces.
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10-5 Laser Quality Surfaces on Sapphire

PPC has recently completed development of advanced polishing processes for sapphire and Ti:sapphire materials. Plano surfaces of up to 2" in diameter have been manufactured to λ/10 peak-to-valley flatness with 10-5 surface quality and RMS surface roughness of less than 6 angstroms (as shown here). Highly polished sapphire substrates and assemblies are ideal for use as high energy waveguides, laser amplifiers and low-order waveplates where durability and chemical resistivity are key requirements. We can also provide on-beam-sputtered (IBS) anti-reflection, beamsplitter and high-reflection coatings on both materials from 266 nm to 2200 nm.
Optical grade Silicon Polishing & Coatings
PPC is now manufacturing optical grade silicon etalons, wafers and assemblies with laser-quality surfaces. PPC has spent considerable effortworking with our suppliers to obtain true “optical grade” material. Our optical grade Si is ideal for applications in the near IR, including telecommunications and optical spectroscopy. Custom silicon components are available uncoated or coated with our durable IBS coatings, and they can also be optically bonded with our epoxy-free CADB™ technology to produce complex monolithic assemblies. Contact us for more information on ultra-parallel wafers and available custom coating options.
NEW CAPABILITIES FOR 2009
In addition to continually improving our polishing, metrology and coating processes, PPC is also intent on expanding our mechanical manufacturing resources. As part of this, we have added both core drilling and laser marking of individual substrates and finished components to our growing list of in-house capabilities. These processes increase our flexibility and ability to respond quickly to customer requirements for non-standard diameters and discrete serialization. Call us with your requirements to see how we can help you today. |